Fairs / Events

The SEM Annual Conference and Exposition focuses on all areas of research and applications pertaining to experimental mechanics, and has evolved to encompass the latest technologies supporting optical methods; additive & advanced manufacturing; dynamic behavior of materials; biological systems; micro-and nano mechanics; fatigue and fracture; composite and multifunctional materials; residual stress; inverse problem methodologies; thermomechanics; and time dependent materials. This broad focus on experimental mechanics includes topics in digital image and digital volume correlation techniques, speed impacts to shock and blast, durability and extreme environmental effects, model/experiment integration, materials for advanced manufacturing, damage detection and non destructive testing, tools spanning various length scales and new experimental techniques and methods to address real-life applications, research and collaborative efforts across all disciplines complementing experimental mechanics.

The Portuguese Society of NDT (FSEND-RELACRE) has the honor to host the European Conference on Non-Destructive Testing (ECNDT) to be held from 3 to -7 of July 2023 in Lisbon, Portugal. This Conference is considered the major international event for EFNDT, its member societies and stakeholders. The event shows the importance of this economic sector and the diversity of its activity and competence to ensure Safety, joining all the community of NDT (Academia, Inspection Companies, Accredited Laboratories, Industry, and Suppliers of Equipment). It is the perfect opportunity for networking and to get in touch with the state-of -art of research and innovation and to meet the developments of equipment provided by the European and World NDT Community. ECNDT 2023 conference is carefully planned to cover a wide range of topics, with a particular focus on the technical and scientific aspects. The program features the most recent advancements in research and development, as well as the application of Non-Destructive Testing (NDT) in various industrial sectors. Simultaneously, an exhibition is taking place, which is closely linked to the conference. The exhibition showcases the equipment and instruments used by the industry, emphasizing the connection between research and development and practical applications.

The ACEX conferences are now a well-established forum, with a balanced portion of delegates from academia and industry in attendance. As such, the conference provides a binding platform for researchers and industry-leaders to network together, exchange ideas, and overcome currently pressing issues related to computational engineering and related experimenting. The conference will provide an excellent opportunity for delegates to meet new collaborators and develop their knowledge of current topics in an attractive, cultural and friendly environment!

Hear the latest research and enjoy another outstanding program at SPIE Optics + Photonics. Make plans to attend this annual event and join leading researchers and scientists as they contribute to advancements in optical engineering, nanotechnology, quantum science, organic photonics, and astronomical instrumentation. Meet face-to-face with premier researchers and discuss your product needs with top optics and photonics suppliers at the free 3-day exhibition. Industry partners will be there to help solve problems, cut costs, and increase capabilities.

About IEEE IUS 2023 The 2023 IEEE International Ultrasonics Symposium will be the 61st edition of this conference and will be held on September 3-8, 2023 in Montreal, Canada at the Palais des congrès de Montréal. Montréal is famous for its special blend of international cultures and Euro-American charm. It is consistently ranked as one of the top host cities in the Americas for international meetings. As a satellite event for the 2023 IEEE International Ultrasonics Symposium, a one-day Symposium on Artificial Intelligence (AI) in Ultrasonics will be held on September 8, 2023 at the same venue. Montréal is internationally known as a hub for AI research and development with the largest AI academic community in the world. Opening Plenary: “Deep Learning and the Challenge of Out-of-Distribution Generalization” by Professor Yoshua Bengio, University of Montreal, one of the founding fathers of deep learning and the recipient of the 2018 Turing Award.

On behalf of the European Association for Signal Processing (EURASIP), it is the great pleasure of the organising committee to invite you to the 31st European Signal Processing Conference, EUSIPCO 2023, to be held for the first time in Helsinki, Finland. EUSIPCO is the premier European conference on signal processing and offers a comprehensive technical program addressing all the latest developments in research and technology for signal processing. The 31st edition of EUSIPCO will be held in Helsinki, the vivid capitol city of Finland. Helsinki is well-known of its sea-facing landscape, diverse architecture, world-famous design, and Nordic cuisine. The conference will be held at Scandic Grand Marina Congress Center, located in beautiful harbor area of the city center of Helsinki that is only a short walking distance from the historic district (the senate square) or presidential palace. The EUSIPCO 2023 technical program will include keynotes by distinguished speakers, tutorials and special sessions, and cutting-edge research presentations on topics that are driving the information revolution and signal processing today.

Das Ilmenauer Wissenschaftliche Kolloquium kann auf eine mehr als 50-jährige lebendige Tradition verweisen und ist das "Flaggschiff" unserer Universität, das einen hervorragenden Ruf genießt. Im Jahr 2023 wird das ISC wieder von der Fakultät für Maschinenwesen ausgerichtet. Das Kolloquium deckt die Breite und Tiefe des modernen Ingenieurwesens sowie die zunehmende Integration der Ingenieurdisziplinen ab. Sie spiegeln auch die Forschungsstrategie und Technologiefelder der Technischen Universität Ilmenau wider. Wie immer in der Konferenzreihe laden wir zu Beiträgen sowohl aus akademischen Einrichtungen als auch aus der Industrie ein und fördern diese. Egal, ob Sie ein erfahrener Fachmann oder ein Neuling im innovativen Maschinenbau sind - wir sind sicher, dass Sie vom 60. Ilmenauer Wissenschaftlichen Kolloquium profitieren werden.

Blechexpo represents the world’s range of products and solutions for the industrial processing of sheet metal, tubes and profiles. The portfolio ranges from raw materials, their storage and handling to the production of ready-to-assemble assemblies, devices, apparatuses and basic machines. Expanded by the complementary Schweisstec – International Trade Fair for Joining Technology, the trade fair duo occupies a special position globally, because nowhere else in the world are the process chains for working and processing sheet metal, tubes and profiles presented as completely as here!