Electronics for NDT Systems

The NDT System Electronics department is structured around three main areas:

• Module development, which serves as a platform for the various NDT processes and combinations of processes
• Prototype implementation for stand-alone, customer-specific solutions
• Microelectronics development, which serves as the basis for new, miniaturized testing concepts and solutions

The NDT System Electronics department relies on several areas of expertise to develop innovative, miniaturized concepts:

• Microelectronics
• Integration and fusion of different NDT sensors such as ultrasound, ultrasound array, electromagnetic ultrasound, eddy current, high-frequency eddy current, nuclear magnetic resonance and magnetic flux leakage
• Intelligent electronic modules (analog, digital, firmware, online algorithms)

R&D projects

Feasibility studies and simulations

Module development: analogue technique, digital technique, FPGA, DSP, microprocessors, firmware development, software  (C++, C# and LabVIEW)

CAD for electric layout and mechanical construction

Prototyping

Services and customer care

Eddy current procedures:

• inspECT multichannel, multifrequency eddy current inspection electronics
  
• Detection of surface, near-surface and cavernous cracks
• Inspection system for hardness layers
• Determination of layer thickness
• Positive material identification
• CFRP fiber orientation