Electronics for NDT Systems

The NDT System Electronics department is structured around three main areas:

• Module development, which serves as a platform for the various NDT processes and combinations of processes
• Prototype implementation for stand-alone, customer-specific solutions
• Microelectronics development, which serves as the basis for new, miniaturized testing concepts and solutions

The NDT System Electronics department relies on several areas of expertise to develop innovative, miniaturized concepts:

• Microelectronics
• Integration and fusion of different NDT sensors such as ultrasound, ultrasound array, electromagnetic ultrasound, eddy current, high-frequency eddy current, nuclear magnetic resonance and magnetic flux leakage
• Intelligent electronic modules (analog, digital, firmware, online algorithms)

R&D projects

Feasibility studies and simulations

Module development: analogue technique, digital technique, FPGA, DSP, microprocessors, firmware development, software  (C++, C# and LabVIEW)

CAD for electric layout and mechanical construction

Prototyping

Production lines, e.g. soldering paste printing, SMD assyembly facility machine, SMD assembly by hand, vapor phase soldering facility, various tools for cable production

Mechanical factory providing various CNC machines

Services and customer care

Eddy current procedures:

• inspECT^® multichannel, multifrequency eddy current inspection electronics
  
• Detection of surface, near-surface and cavernous cracks
• Inspection system for hardness layers
• Determination of layer thickness
• Positive material identification
• CFRP fiber orientation